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RO3000® Series Circuit Materials

RO3003TM, RO3006TM, RO3010TM and RO3035TM High Frequency Laminates

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.

RO3000 series laminates are ceramic-filled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems.

RO3000 materials exhibit a coefficient of thermal expansion (CTE) in the X and Y axis of 17 ppm/oC. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage (after etch and bake) of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/ °C, which provides exceptional plated through-hole reliability, even in severe thermal environments. The dielectric constant versus temperature for RO3003TM and RO3035TM materials is very stable (Chart 1).

RO3000 series laminates can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques, with minor modifications as described in the application note “Fabrication Guidelines for RO3000 Series High Frequency Circuit Materials.”

RO3000 laminates are manufactured under an ISO 9001 certified system.

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