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Interposer & Adapter Solutions Interposer & Adapter Solutions

Murrietta Circuits offers custom designed interposer and adapter solutions for a wide range of applications, including: BGA to PGA, BGA to QFP, BGA to BGA, QFP to BGA, SMT to DIP, SMT to SMT, PGA to PGA and more. We can also add custom features like decoupling caps, power & ground planes, Jtag connectors, voltage regulators, CTE matching and more.

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What is an interposer?

Interposers are substrates that are used to attach components as an intermediate step to directly attaching to the main/motherboard. The interposer then becomes the new package for attaching onto the circuit board. This substrate can be made from a wide range of materials, including FR4, Polyimide, Rogers, Getek and Stablcor.

Why would I need one?

An interposer or adapter can be used to solve any number of problems. Most commonly it is used as an interface to adapt obsolete components to a legacy circuit board that cannot be redesigned, or is impractical to redesign. This is becoming more of an issue due to the migration to lead-free components and the unwillingness of the component manufacturers to support legacy products.

The density (or pitch) of my BGA is dramatically increasing the complexity of my main circuit board, thus driving up our production costs.

A custom designed interposer from Murrietta Circuits is a recommended solution. By using fan-out techniques, we can greatly simplify your main/motherboard design by containing all the complexity of the BGA package within a small footprint. The interposer can utilize any footprint style from BGA to BGA, BGA to PGA, or BGA to QFP.

The density and packaging of my IC is creating too much heat and causing hot spots on the motherboard.

A custom designed interposer from Murrietta Circuits, utilizing high temp materials from FR4, Polyimide, Rogers, Getek or Stablcor. By using a higher grade of materials exclusively on the interposer, you can contain or greatly reduce the heat being generated from this device. In addition, you are containing the cost of the higher grade materials within a smaller footprint, thus reducing your overall production manufacturing costs.

The pitch of my BGA is so tight that I am finding it impossible to route-out of the package using conventional design & manufacturing standards.

Again, by using fan-out techniques, we can greatly simplify your main/motherboard design. If HDI techniques and/or high layer counts are to be used, it is better to employ them on a smaller package than across the entire motherboard. It saves you dollars and speeds up your design cycle.

What information do I need to provide for a quote?

  • Spec sheet on new component and mechanical drawing of target footprint
  • Netlist and schematic for interposer
  • Routing requirements: controlled impedances, ground planes, matched lines, differential pairs, etc.
  • Any additional features you would like to include on the interposer/adapter (e.g. decoupling caps, Jtag connectors, voltage regulators, etc.)
  • Quantity and lead time required for prototype and production

Whats the normal lead time possible for a bga-to-bga adapter?

All our interposers are custom designed to fit the exact chip for your application. The .8mm does not tell us enough info as different BGA's have different quantities of pins and patterns or rows. The lead time is about 6-8 weeks, but can be expedited to 3-4 weeks with the right information up front.

Can I get some form of datasheet?

Since it is custom designed there are no pre-defined data-sheets.

What are the typical cost associated with such solution?

The cost can range from $5k to $10k depending on the complexity of the interposer and that would yield about 25-50 interposers. Most of this is one time NRE's and fixtures, so your ongoing unit cost would be low.

The BGA Interposer Challenge

  • Obsolete parts are increasing due to lead-free changeovers.
  • High reliability industries (aerospace, military, medical, etc.) still need leaded BGAs due to tin whiskering concerns.
  • High reliability must support programs for 5 to 15 years or more, unlike the commercial sector.
  • BGA density is ever increasing, adding layers to main/motherboards.
  • BGA packages less than 1.0 mm (0.4mm to 0.8mm) must use some form of HDI and blind/buried vias at the PWB level.
  • The added complexity affects the entire main board, even if it is only for 1 device.
  • The higher density, increases component level heat and thus causes "hot spots" on the main board.

The Interposer Solution

Interposers adapt any style footprint to any other:

  • BGA to BGA
  • BGA to PGA
  • BGA to QFP
  • BGA (lead-free) to BGA (leaded)
  • SMT to DIP

Reduces BGA density & thus mainboard complexity by fanning out the pitch:

  • 0.40 mm to 1.0 mm (or larger)
  • 0.50 mm to 1.0 mm (or larger)
  • 0.65 mm to 1.0 mm (or larger)
  • 0.80 mm to 1.0 mm (or larger)

Reduces layer count on main board.

Eliminates blind/buried vias on main board.

Optional custom features can be added, like:

  • Decoupling caps
  • Jtag connectors
  • Power & ground planes
  • Embedded capacitance
  • Boundary scan programming and testing
  • Stablcor (Better CTE match, better thermal management, and increased rigidity)

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