Complete design and engineering solutions, from hardware design, component selection, BOM construction, schematic capture and simulation.
Capable of building even the most complex circuit boards, with new automated equipment to handle high layer count, thin core (down to .001), fine line, blind via & buried via technology.
Unique designs to solve interconnection problems, reduce costs, improve internal appearance and better dissipate heat.
RoHS compliant SMT & Thru-hole PCB assembly with 3 high speed SMT lines, 2 prototype lines, in-line stencil printing, AOI, X-ray, BGA underside inspection, and the latest in CAM software tools.
Find the part you need with our team of purchasing and program management professionals.
Change your final finish from one metallic type to another.
Full range of board level testing and environmental screening.
Custom designed interposer and adapter solutions for a wide range of applications, including: BGA-PGA, BGA-QFP, BGA-BGA, QFP-BGA, SMT-DIP, SMT-SMT, PGA-PGA and more.
We help you design your board to be easier and cheaper to manufacture.