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Our fabrication department is equipped to build to your exact specifications. See our equipment list and capabilities for precise details.



Fabrication Capabilities

  Standard Advanced Limited Run

Materials

     
FR-4, 170Tg Available - -
FR-4, >170Tg - Available Available
Polymide, 260Tg Available Available Available
Teflon - Available Available
Rogers 4003 Available Available Available
Lead-free temp rated Available Available Available
Ceramic Available Available Available
Low loss - Available Available
Halogen Free Available Available Available
BT Epoxy Available Available Available
Cyanate Ester Available Available Available
Stablcor Available Available Available
       

Inner Layers

     
Min. Core Dielectric >= .004 .003 .002
Min. Line 1/2 oz. copper >= .00375 .0035 .003
Min. Space 1/2 oz. copper >= .00375 .0035 .003
Min. Line 1 oz. copper .004 .00375 .0035
Min. Space 1 oz. copper .004 .00375 .0035
Min. Line 2oz. copper .005 .004 .00375
Min. Space 2oz. copper .005 .004 .00375
Min. Pad size over drill (overall) .012 .010 .008

Min. Plane Clearance diameter over drilled hole (overall)

.020 .016 .012
       

Outer Layers

     
Min. Line 1 oz. copper .004 .00375 .0035
Min. Space 1 oz. copper .004 .00375 .0035
Min. Line 2 oz. copper .006 .005 .004
Min. Space 2 oz. copper .006 .005 .005
Min. Line 3 oz. copper .008 .007 .006
Min. Space 3 oz. copper .008 .007 .006
Base copper foil .5 oz. .375 oz. .25 oz.
Min. Pad over drill (overall) 0.12 .010 .008
       

Multi-Layer Construction

     
Max. Layers 16 24 >26
Max. Thickness <= .125 .125-.250 >= .250
Min. Thickness Tolerance +/- 10% +/- 7% +/- 5%
Blind & Buried Vias Yes Yes Yes
Controlled Dielectrics Thickness +/- .003 +/- .002 +/- .001
Layer to Layer Registration +/- .005 +/- .003 +/- .003

Bow & Twist (inch per inch)

> .007 > .005 > .005
       

Drilling

     
Min. Drill Size .010 .008 .007
Controlled Depth Drilling No Yes Yes
Drill Position +/- .003 +/- .003 +/- .002
Laser Drilling No Yes Yes
       

Electrolytic Plating

     
Max. Aspect Ratio, Copper (thru-hole) 9:1 10:1 12:1
Max. Aspect Ratio, Copper (micro via) .5:1 .75:1 .85:1
Plasma Etch-back Yes Yes Yes
Electrolytic Hard Gold, tips, selective Yes Yes Yes
Electrolytic Soft Gold Yes Yes Yes
Conductive Silver Via Fill No Yes Yes
Edge Plating Yes Yes Yes
       

Solder Mask & Legend

     
Solder Mask Type (LPISM) Taiyo PSR-400 Any Any
Colors (Green, blue, red, clear, black) Green Any Any
Min. Solder Mask Dams .004 .0035 .003
Min. Solder Mask Clearance .004 .003 .003
Legend Colors (White, yellow, black, red) White Any Any
Via Fill Yes Yes Yes
Via Tent (Dry Film) Yes Yes Yes
Carbon Paste Yes Yes Yes
Dry Film Solder Mask Available Available Available
       

Surface Finishes

     
Solder Leveling Yes Yes Yes
White Immersion Tin Yes Yes Yes
Immersion Gold Yes Yes Yes
Immersion Silver Yes Yes Yes
OSP Yes Yes Yes
Entek Yes Yes Yes
       

Fabrication

     
Fabricated dimensions (routing) +/- .005 +/- .004 +/- .004
Fabrication radius +/- 5° +/- 5° +/- 5°
Fabricated dimensions (scoring, X & Y axis) +/- .010 +/- .005 +/- .005
Fabricated dimensions (scoring, Z axis) +/- .005 +/- .004 +/- .004
Beveling Yes Yes Yes
Edge Milling Yes Yes Yes
Counter-sink/bore Yes Yes Yes
       

Testing

     
Double Sided Grid (.070/.080) Yes Yes Yes
Flying Probe Yes Yes Yes
Single edged
Differential
Broad-side coupled
Edge coupled
Yes Yes Yes
Impedance Tolerance +/- 10% +/- 10% +/- 8%

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